Invited Speakers

Home        Invited Speakers        Important Dates        Registration        Venue


Invited speakers:

Byoung Hoon Lee Ewha Womans University, South Korea

Choon-Gi Choi Korea University of Science & Technology, Korea

Dae-Eun Kim Yonsei University, Korea
Surface Durability Enhancement of Flexible Polymeric Components

Diego Betancourt Dresden University of Technology, Germany

HaeDo Jeong Pusan National University, Korea
CMP process and equipment for flexible electronics

Haris Rudianto Gunadarma University, Indonesia
Feasibility of Aluminum and its Composites as a Conductor Based on their Chemical Compositions and Manufacturing process

Hu Seung Lee Chungnam National University, Korea

reliability of electrode patterning according to the blending of nanoparticle

Insuk Choi Korea Institute of Science and Technology, Korea

Jin-Seong Park Hanyang University, South Korea

Kee-Jeung Hong Kookmin University, South Korea
developing analytical models for flexible conductor cables, where wires are helically wrapped at multiple layers

Masatoshi Sakai Chiba University, Japan

Flexible and Curved Surface Electronics by Solvent-Free Printing

Masayoshi Higuchi National Institute for Materials Science, Japan
Cuttable Electrochromic Display Sheets Using Metallo-Supramolecular Polymers

Patrick Mercier University of California, USA

Qian Xin Shandong University, China
High frequency flexible Schottky diodes based on InGaZnO

Richard Spontak North Carolina State University, USA

Seung Hwan Ko Seoul National University, South Korea
Metal Nanowire Percolation Network Based Flexible Electronics

Shigeru Toyama National Rehabilitation Center for Persons with Disabilities, Japan
Shear force sensor based on flexible electrode film

Siddhartha Panda IIT Kanpur, India

Sin-Doo Lee Seoul National University, Korea
Principle of Topography-Directed Inkjet Printing on Flexible Substrates

Yamato HAYASHI Tohoku university, Japan

Yong Peng Wuhan University of Technology

Yong Soo Cho Yonsei University, Korea
Quantitative Analysis of Bending Fracture Behavior of Flexible Inorganic Thin Films

Yong-Young Noh Dongguk University, Korea

Yuehang Xu University of Electronic Science and Technology of China, China